Reliability Characteristics of a Package-on-Package with Temperature/Humidity Test, Temperature Cycling Test, and High Temperature Storage Test
نویسندگان
چکیده
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ژورنال
عنوان ژورنال: Journal of the Microelectronics and Packaging Society
سال: 2016
ISSN: 1226-9360
DOI: 10.6117/kmeps.2016.23.3.043